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3M Diamond Lapping Film 662XW Type H by 3M
$
9
17
/ 1
- Part Number: 7010309474
- UPC: 00511448632970
- Availability:
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Product Overview
3M Diamond Lapping Film 662XW Type H; 1.0 Micron Disc; 5 in x NH Die# 500X; 25/Inner; 250/Case; Telcom
3M Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50; 1.0; 1.50; 3.0; 6.0 and 9.0 micron grades.
3M Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50; 1.0; 1.50; 3.0; 6.0 and 9.0 micron grades.
Specifications
Details
Category:
Abrasives
Subcategory:
Polishing
Abrasive Material:
Diamond
Grade:
Non Pertinent
Grit:
Non Pertinent
Center Hole Diameter (Imperial):
0 NP
Center Hole Diameter (Metric):
0 NP
Country of Origin:
USA
Features1:
A higher diamond concentration and a stronger resin bond give this product added durability and increased cut rate
Features2:
Available in discs, rolls and sheets
Features3:
Flat surface, no rounding
Features4:
Good finish
Features5:
Increased throughput
Features6:
Long abrasive life minimizes disc changes
Legacy SKU:
60650025681
Micron Grade:
1 μm
Overall Diameter (Imperial):
5 in
Overall Diameter (Metric):
127 mm
Part Number:
662XW
Product Form:
Disc
SAP ID:
7010309474
Total Tape Thickness without Liner (Imperial):
42 mil
Total Tape Thickness without Liner (Metric):
1.07 mm
Manufactured By:
3M